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Keywords: SEP epoxy color paste · bisphenol-A prepolymer carrier · amine / anhydride / imidazole cure · 300 °C thermal stability · volume resistivity · dielectric strength · REACH / RoHS / IEC 60085 / UL94
Epoxy thermosets are the workhorse of electrical insulation and heavy-duty anti-corrosion engineering. From encapsulated signal transformers on a printed circuit board, through IGBT power modules that switch hundreds of amps at 1200–3300 V, to fusion-bonded epoxy (FBE) coatings on 12 m steel pipe strings, the cured epoxy must do four jobs at once: bind the system, exclude moisture and chemicals, insulate electrically, and — increasingly — carry a specific colour for coding, traceability or aesthetics. Adding that colour is not as simple as stirring in a generic pigment. The colourant has to disperse cleanly in the liquid epoxy, survive the potting or cure exotherm, not bleed into the hardener, not raise the ionic (Cl⁻, Na⁺, K⁺) background that would destroy long-term dielectric performance, and carry the same compliance burden as the finished assembly when it ships to the EU, North America or Japan.
DENSON's SEP epoxy color paste is engineered specifically for this chemistry. Unlike the polyether-polyol-borne PUE series (for polyurethane), the solvent-borne FLTY series, the water-borne GT series, the UV-curable FLUV series or the electron-beam-cured EB range, SEP uses a bisphenol-A epoxy prepolymer itself as the carrier. The pigment is pre-dispersed into a low-viscosity liquid epoxy resin that is chemically identical in backbone to the customer's own base epoxy, so dosing SEP is essentially adding a little extra epoxy with colour in it — no foreign resin, no solvent, no water, no photoinitiator. This article walks through the carrier chemistry, dispersion colloid science, the three application windows (electronic encapsulation, CCL/electrical insulation, heavy-duty anti-corrosion/FRP/flooring), the selection data, and the full global compliance package that every SEP drum ships with.
Figure 1. Red epoxy-encapsulated PCB-mount transformer. SEP red paste is dosed into the liquid epoxy before vacuum potting; the cured block encapsulates the winding, excludes moisture and provides a colour-coded, traceable part.
An epoxy system is fundamentally a two-component reaction: a liquid bisphenol-A (or novolac) epoxy prepolymer, carrying epoxide end-groups, reacts with a hardener — a polyamine, a cyclic anhydride, or an imidazole catalyst — to build a densely crosslinked three-dimensional network. If you add a colourant carrier that is anything other than an epoxy resin, you introduce a foreign molecule into that cure reaction. A solvent-borne paste (FLTY) adds VOCs that remain trapped in the potting and later bloom; a water-borne paste (GT) introduces water that hydrolyses glass fibre in FRP and creates voids; a polyol-borne paste (PUE) simply does not react in an epoxy matrix at all and becomes a soft, greasy contaminant at the epoxy–chip interface.
SEP avoids all of this by dispersing pigment directly into a liquid epoxy prepolymer that shares the bisphenol-A backbone of the customer's base resin. The epoxide end-groups on the carrier react with the hardener just like any other resin molecule, becoming a real part of the crosslinked network rather than an inert contaminant. This is why SEP is described as an epoxy-borne, epoxide-reactive colorant — it is neither solvent-free in the UV sense nor water-borne; it is a reactive concentrate designed for amine, anhydride and imidazole cure systems.
| Property | Typical SEP value | Engineering benefit |
|---|---|---|
| Thermal stability | Up to 300 °C short-term; 200 h at 180 °C no shade shift | Survives wave-solder reflow, transformer potting exotherm, FBE oven cure |
| Weather resistance | 500 h QUV-A no chalking / no shade shift in aromatic grades; aliphatic UV-resistant grades available | Outdoor anti-corrosion, steel structure, coastal pipeline service |
| Volume resistivity | ≥ 1 × 10¹⁴ Ω·cm at 25 °C (cured) | Meets Class B/F/H insulation expectations |
| Dielectric strength | ≥ 18 kV/mm (1 mm cast plate, GB/T 1408 / ASTM D149) | Suitable for medium-voltage encapsulation |
| Pigment loading | 20–35% depending on shade | Addition at 0.3–2.0 pph; minimal impact on Tg and mechanicals |
| Curing compatibility | Amine (aliphatic, cycloaliphatic, polyamidoamine), anhydride (MTHPA, HHPA), imidazole (2-MI, 2E4MZ) | Drops into customer's existing formulation without reformulation |
| Colour purity | Vibrant red, blue, yellow, green, black, white; ΔE ≤ 1.0 batch-to-batch | Colour coding on transformers, capacitors, industrial flooring |
The high pigment loading means a typical SEP addition rate of 0.3–2.0 parts per hundred parts of resin (pphr) delivers full colour, so the colourant contributes only a few percent of extra resin to the system — negligible effect on crosslink density, glass-transition temperature (Tg), shrinkage or exotherm peak. The pigments selected are high-temperature organic and inorganic grades (e.g. quinacridone red, phthalocyanine blue/green, isoindolinone yellow, rutile TiO₂, thermal-grade carbon black) chosen specifically to hold colour at 300 °C short exposure and through 180 °C long-term ageing, without the lead chromates, cadmium sulfoselenides or hexavalent chromium pigments that would immediately fail RoHS and REACH.
Pigment dispersion is a three-step process: wetting of the pigment aggregates by the liquid carrier, mechanical breaking of agglomerates under high shear (bead mill or three-roll mill), and stabilisation of the newly exposed particle surface so particles do not re-flocculate during pot life. In a bisphenol-A epoxy carrier, wetting is governed by two molecular parameters:
Epoxide equivalent weight (EEW) and viscosity. A lower-EEW, lower-viscosity liquid epoxy (e.g. EEW 185–196, 10–14 Pa·s at 25 °C) wets pigment surfaces quickly and pumps through bead-mill chambers at manageable temperatures. DENSON uses this grade for high-loading black and dark shades, where carbon black agglomerates are the hardest to break apart. A higher-EEW semi-solid epoxy is used only where the customer needs a softer, more flexible cured matrix.
Dispersant package. A block-copolymer dispersant, anchored to the pigment surface by acidic or basic groups and tail-anchored into the epoxy matrix, provides steric stabilisation. This prevents flocculation during the 4–8 h pot life of a typical amine system and the longer 8–24 h working window of an anhydride system. The dispersant itself is epoxide-reactive so it does not leach out of the cured part.
Typical target fineness is ≤ 10 μm on a grindometer (Hegman 6+), measured against the customer's largest conductor gap. For IGBT modules, where the potting must flow around 0.5 mm wire bonds and chip spacers, fineness is tightened to ≤ 5 μm so the paste does not abrade bond wires or bridge delicate gate structures.
Colour change at high temperature can fail by two routes: decomposition of the pigment itself, or yellowing of the epoxy matrix. DENSON controls both. The pigment side uses thermally stable chemistries: quinacridone reds (thermally stable to 320 °C), phthalocyanine blue/green (300–350 °C), isoindolinone and isoindoline yellows (280–300 °C), rutile TiO₂ (melting point 1840 °C), and channel-furnace carbon black (stable above 400 °C in inert atmosphere). Lead chromate, cadmium and azo pigments are excluded on both compliance and thermal grounds. The resin side uses high-Tg epoxy systems — novolac epoxy or BPA epoxy cured with methylhexahydrophthalic anhydride (MHHPA) and an imidazole accelerator — which reach Tg of 130–150 °C and post-cure to a lightly yellowed matrix. An antioxidant package (hindered phenol + thioether) suppresses oxidative yellowing during the 200 h at 180 °C thermal-ageing test.
Electrical insulation in a cured epoxy potting depends on three things: (i) the intrinsic resistivity of the cured network, (ii) the ionic purity of the system, and (iii) the absence of conductive pathways through defects.
DENSON controls ionic purity aggressively. Raw pigments are washed and tested for water-extractable chloride (Cl⁻), bromide (Br⁻), sulfate (SO₄²⁻), sodium (Na⁺) and potassium (K⁺). The SEP specification holds Cl⁻ below 10 ppm and total halides below 15 ppm in the paste, because mobile ions under DC bias migrate to the cathode and cause electrochemical treeing — the single most common failure mode of potted electronics after 10+ years in service. This is also why SEP never uses chlorinated blue/green phthalocyanine pigments in the low-halogen grade (see §7.1). For semi-conductive or shielding grades, controlled carbon-black percolation at 8–12% loading drops volume resistivity into the 10⁶–10⁹ Ω range, providing a controlled resistive layer around medium-voltage coils without turning the whole potting into a conductor.
| Design choice | Controls | Result in cured part |
|---|---|---|
| Low-Cl⁻ washed pigments (< 10 ppm) | Ionic contamination | Resists electrochemical treeing; volume resistivity holds ≥ 10¹⁴ Ω·cm after damp-heat ageing |
| Fineness ≤ 10 μm (≤ 5 μm IGBT grade) | Void formation, wire-bond abrasion | No micro-voids at chip interface; dielectric strength ≥ 18 kV/mm |
| Epoxy-prepolymer carrier (not solvent/water) | Trapped volatiles | Zero outgassing; no post-cure blistering under vacuum potting |
| Thermal-stable pigment selection | High-T decomposition → conductive char | No carbonised conductive paths through 300 °C short exposure |
| Controlled carbon-black percolation (semi-conductive grade) | Field grading around MV coils | 10⁶–10⁹ Ω·cm resistive layer without making the whole potting conductive |
The largest single outlet for SEP color paste is electronic encapsulation — the vacuum potting of wound components and power semiconductors in liquid epoxy, which then cures to a hard, hermetic block. Figure 1 already showed a red-encapsulated PCB-mount transformer. The same family covers signal transformers, current transformers, switch-mode-power-supply (SMPS) transformers, PFC inductors, film and aluminium electrolytic capacitors, relay coils, and — most demanding of all — IGBT power modules used in motor drives, railway traction, renewable-energy converters and EV inverters.
In a transformer potting line, the wound bobbin is placed in a mould, liquid epoxy (BPA resin + anhydride or amine hardener + silica filler + SEP colour paste) is degassed under vacuum, poured, and cured at 80–120 °C for 2–4 h followed by a post-cure at 130–150 °C for 4–8 h. SEP black is the workhorse for hidden, general-purpose pottings; red, blue and green grades provide colour coding that lets assembly workers and downstream service technicians distinguish 12 V from 24 V from 48 V units at a glance. The 300 °C short-term rating matters because through-hole transformers are wave-soldered at 260 °C for 3–5 s after potting — a generic pigment would brown or bleed at this step, but the SEP pigment system holds colour.
Figure 2. IGBT power modules before and after black epoxy potting. The copper chips and bond wires are visible on the left; the finished modules on the right are fully encapsulated in black, low-Cl⁻ epoxy dosed with SEP black grade.
IGBT modules (Figure 2) are the most demanding encapsulation application. Each module contains silicon chips soldered to a direct-bonded copper (DBC) substrate, aluminium bond wires, and a plastic or aluminium housing. The potting must fill gaps of 0.5–2 mm without voids, survive continuous junction temperatures of 125–175 °C, and not crack through hundreds of thousands of thermal cycles from −40 °C to +150 °C. SEP is used here in a low-viscosity, silica-filled, anhydride-cured formulation at ≤ 5 μm fineness, with extra-low chloride (≤ 5 ppm) to meet the long-term reliability targets of automotive-grade (AEC-Q) and traction customers. The carbon-black grade also doubles as a UV blocker, slowing photo-degradation of the plastic housing around the module.
Capacitor encapsulation — both film capacitors for power-factor correction and aluminium electrolytics for bulk decoupling — uses SEP black and dark grey grades to cover the can and eliminate daylight (which attacks the rubber bung over years). Because capacitor pots see continuous ripple current and self-heating up to 105 °C, the high-temperature pigment system is essential.
A second major outlet for SEP is the fibreglass-reinforced epoxy composite that underpins the entire printed-circuit-board (PCB) industry: the copper clad laminate (CCL). FR-4 grade CCL is built by impregnating woven E-glass fabric with a B-stage epoxy resin (a half-cured varnish), stacking prepreg layers between sheets of copper foil, and pressing at 170–190 °C under 20–40 bar to fully cure the epoxy into a rigid, insulating board. Colour here is usually a green, blue, black or red dye in the B-stage varnish that identifies grade and supplier — and, increasingly, low-halogen (Hal-free) material families for consumer electronics.
Figure 3. CCL production line. The B-stage epoxy varnish impregnates glass fabric under tightly controlled temperature and tension; SEP color paste is dosed into the varnish kettle to give the cured laminate its characteristic green, blue or black shade.
SEP enters CCL manufacturing at the varnish kettle, typically at 0.1–0.5 pph because the colour only needs to be pale and identifying rather than opaque. The paste must survive the 170–190 °C press cycle without decomposition, without migrating into the copper foil interface, and without raising the ionic background that would degrade insulation resistance over the board's service life. This is the application where the low-halogen, low-Cl⁻ spec matters most: consumer-electronics OEMs require IEC 61249-2-21 (Cl < 900 ppm, Br < 900 ppm, total halogens < 1500 ppm), and DENSON supplies Hal-free SEP grades that exclude chlorinated phthalocyanines and use bromine-free organic pigments.
Beyond CCL, SEP colours a wide range of general electrical insulation: epoxy-bonded mica tape for motor and generator stator insulation, epoxy resin castings for bushings and switchgear, epoxy-reinforced fibreglass tubes and rods for high-voltage line hardware, and room-temperature-vulcanising (RTV) epoxy coatings on busbars. All of these share the same demands — volume resistivity ≥ 10¹² Ω·cm, dielectric strength ≥ 15 kV/mm, thermal class defined by IEC 60085 (Class B 130 °C, Class F 155 °C, Class H 180 °C) — and the same compliance burden.
The third major window is protective anti-corrosion coating. Fusion-bonded epoxy (FBE) is a thermoset powder coating applied by heating a steel pipe to 230–240 °C and spraying electrostatically; the powder melts, flows and cures in seconds to a 300–500 μm adherent film. FBE protects oil and gas transmission pipelines, municipal water and sewer lines, rebar in concrete bridges, and offshore steel structures. Colour is usually a standardised orange-brown, black or beige, and the pigment must survive the 230–240 °C oven flash without discolouring.
Figure 4. Yellow fusion-bonded epoxy coated steel pipes. FBE is electrostatically sprayed onto heated steel at 230–240 °C; the pigment in the powder must hold colour through the oven cure and decades of outdoor burial.
Liquid epoxy anti-corrosion coatings for tanks, vessels, bridges and steel structures use SEP in the two-pack topcoat: a high-build epoxy mastic in red oxide, grey, or safety yellow that survives coastal salt spray, immersion service in chemical tanks, and 20+ years of outdoor weathering. The weather-resistant grade of SEP uses quinacridone and isoindolinone pigments rather than cheap azo pigments, so the film passes 1000 h salt spray (ASTM B117) and 500 h QUV-A without chalking or shade shift.
Self-levelling epoxy floors in warehouses, food plants, pharmaceutical cleanrooms and electronics factories are typically 100–300 μm clear or pigmented coats over a concrete primer. SEP red, green, grey and yellow grades are used at 1–3 pph to give the floor a clean, seamless, chemical-resistant surface. The paste must be miscible in a cycloaliphatic-amine-cured, 100%-solids self-levelling system and must not settle in the drum. The 300 °C rating is not directly needed here — floor cure is at 25 °C — but the pigment lightfastness is, because industrial floor warranties run 10 years and demand no fading under strip-light and sunlight exposure.
Figure 5. Self-levelling yellow epoxy floor in an industrial workshop. SEP yellow paste is dosed into the 100%-solids self-levelling compound to deliver a seamless, chemical-resistant decorative finish.
Fibreglass-reinforced plastic (FRP) — the pultruded structural profiles, hand-laid tanks, filament-wound pipes and moulded gratings used in chemical plants, cooling towers and offshore platforms — is typically built from an epoxy (or vinyl-ester) resin impregnating E-glass fabric. SEP is dosed into the resin bath at 0.3–1.5 pph to give the composite a uniform colour (usually grey, green or black) and, in the black grade, a UV blocker that slows outdoor photo-degradation. Because FRP is often used in corrosive chemical service, the low-Cl⁻, phthalate-free, heavy-metal-free compliance package is a prerequisite for OEM qualification.
| Parameter | Typical SEP value | Notes / test method |
|---|---|---|
| Carrier | Bisphenol-A liquid epoxy prepolymer (EEW 185–196) | Reactive in amine/anhydride/imidazole cure |
| Pigment fineness | ≤ 10 μm standard; ≤ 5 μm IGBT grade | Grindometer / Hegman gauge |
| Pigment loading | 20–35% by shade | Ash content, ISO 3251 |
| Recommended addition | 0.3–2.0 pph on resin | 0.1–0.5 pph in CCL varnish |
| Heat resistance | 300 °C short-term (wave-solder / FBE flash); 200 h at 180 °C | ΔE ≤ 2.0 after thermal cycle |
| Volume resistivity (cured) | ≥ 1 × 10¹⁴ Ω·cm at 25 °C | IEC 60093 / GB/T 1410 |
| Dielectric strength (cured) | ≥ 18 kV/mm (1 mm plate) | GB/T 1408 / ASTM D149 / IEC 60243 |
| Water-extractable Cl⁻ | ≤ 10 ppm (standard); ≤ 5 ppm (IGBT grade) | Ion chromatography |
| Curing agents compatible | Aliphatic/cycloaliphatic amine, polyamidoamine, MTHPA/HHPA/MHHPA anhydride, 2-MI/2E4MZ imidazole | No cure inhibition |
| Shelf life | 12 months sealed, 10–30 °C | Stir before use |
| Regulation / standard | Scope | DENSON SEP status |
|---|---|---|
| REACH (EC 1907/2006) — SVHC candidate list | Substances of Very High Concern | < 0.1% w/w SVHC; screened against latest ECHA candidate list each batch |
| REACH Annex XVII | Restricted substances in articles | No banned azo colorants, PAHs, CMR pigments; no lead/cadmium/chromate colorants |
| RoHS (2011/65/EU) + (EU) 2015/863 | Hazardous substances in EEE | Pb < 100 ppm, Cd < 10 ppm, Hg < 100 ppm, Cr⁶⁺ < 100 ppm, PBB/PBDE < 1000 ppm; four phthalates < 1000 ppm |
| IEC 60085 (thermal class) | Electrical insulation thermal endurance | Cured SEP grades qualified for Class B (130 °C), Class F (155 °C) and Class H (180 °C) systems; 300 °C short-term surge rating |
| GB/T 1408 (dielectric strength) | Chinese national standard for solid insulation | ≥ 18 kV/mm measured per GB/T 1408.1; aligned with IEC 60243 / ASTM D149 |
| UL 94 (flame retardancy) | Flammability of plastic materials | When formulated with halogen-free FR additives, cured SEP systems achieve UL 94 V-0; carbon-black grades contribute to char formation |
| GHS / CLP (EC 1272/2008) | Classification, labelling, packaging | SDS per REACH Annex II (rev. 2020/878); GHS label on drum; standard shades not skin-sensitisers |
| CBAM (EU 2023/956) | Carbon Border Adjustment Mechanism | Epoxy-borne, zero-solvent; EPD and product-level carbon statement available on request |
| IEC 61249-2-21 (low halogen) | Halogen-free materials for electronics | Hal-free grades: Cl < 900 ppm, Br < 900 ppm, total halogens < 1500 ppm; no chlorinated phthalocyanines |
| Phthalate-free | DEHP, DBP, BBP, DIBP, DINP, DIDP, DnOP | None intentionally added; below 100 ppm each; tested per EN 14372 / CPSC-CH-C1001 |
| Heavy-metal-free | Pb, Cd, Cr⁶⁺, Hg, Ba, Se, Sb, As | Organic pigments, TiO₂ and carbon black only; no lead chromate, cadmium sulfoselenide or mercury colorants |
| SDS / labelling | REACH Title IV; CLP; local transport regs | English + Chinese SDS; multi-lingual labels on request; UN non-dangerous-goods declaration |
Every drum of DENSON SEP ships with a Certificate of Analysis (pigment loading, fineness, EEW, Cl⁻, moisture), a REACH Annex II SDS as amended by (EU) 2020/878, and a declaration of conformance covering REACH SVHC, RoHS, IEC 60085 thermal class, GB/T 1408 dielectric strength, UL 94 flame-retardant compatibility, IEC 61249 low-halogen status, phthalate-free and heavy-metal-free documentation. For CBAM-bound shipments, DENSON provides a product-level carbon-footprint statement on request. Explore the full SEP range and the broader DENSON colorant portfolio on the DENSON homepage or browse the product listing.
Q1. Is SEP a solvent-borne or water-borne epoxy color paste?
Neither. SEP is epoxy-prepolymer-borne: the carrier is a liquid bisphenol-A epoxy resin that itself reacts with the amine, anhydride or imidazole hardener and becomes part of the crosslinked network. It contains no solvent (unlike DENSON FLTY series) and no water (unlike GT series), and it is not polyol-borne (PUE), UV-curable (FLUV) or electron-beam-cured (EB). This is why SEP must not be substituted into polyurethane, coating-ink or UV systems that do not contain epoxy resin.
Q2. Can SEP really survive 300 °C? What does that number mean in production?
The 300 °C figure is a short-term exposure rating — 3–5 seconds at wave-solder reflow (260 °C), or the 30–60 second FBE powder-coat oven flash on heated steel at 230–240 °C. It is not a continuous-service temperature; long-term continuous service is governed by the cured system's Tg and by IEC 60085 class (B 130 °C, F 155 °C, H 180 °C). Under long-term ageing, SEP passes 200 h at 180 °C with ΔE ≤ 2.0, which is the relevant specification for continuous transformer and IGBT service.
Q3. Why is chloride (Cl⁻) so important in an epoxy potting colourant?
Mobile chloride ions migrate under DC bias to the cathode, where they hydrolyse and create acidic conditions that drive electrochemical treeing — the dominant long-term failure mode of potted electronics. Even 50 ppm of Cl⁻ can shorten the service life of a 1200 V IGBT module from decades to a few years. DENSON washes raw pigments and holds SEP Cl⁻ below 10 ppm (5 ppm on the IGBT grade), which is also what makes the low-halogen grade meet IEC 61249-2-21 for CCL and PCB applications.
Q4. Which curing agents is SEP compatible with?
SEP is formulated to be fully compatible with the three mainstream epoxy cure families: (i) amines — aliphatic (DETA, TETA), cycloaliphatic (IPDA, PACM) and polyamidoamine adducts for room-temperature cure; (ii) anhydrides — MTHPA, HHPA, MHHPA for electrical casting and CCL; and (iii) imidazoles — 2-MI, 2E4MZ as latent accelerators in B-stage and one-pot systems. Because the carrier is itself epoxide-functional, it does not inhibit cure, does not require index correction, and does not bleed. DENSON supplies each batch with a measured EEW so the customer's formulator can dose the small extra resin contribution precisely.
Q5. Is SEP suitable for REACH, RoHS and low-halogen electronics applications?
Yes. Standard SEP already meets RoHS (2011/65/EU) and REACH SVHC (<0.1%), is phthalate-free and heavy-metal-free. For CCL, PCB and EV/automotive parts, specify the low-halogen Hal-free grade, which meets IEC 61249-2-21 (Cl < 900 ppm, Br < 900 ppm, total halogens < 1500 ppm) and excludes chlorinated phthalocyanine blue/green pigments. Third-party SGS/Intertek test reports are supplied on request for every shade and every batch.
The carrier is epoxy — not a contaminant. SEP disperses pigment into a bisphenol-A liquid epoxy prepolymer that cures in place with amine, anhydride or imidazole hardeners. There is no solvent, no water, no foreign resin, and no cure inhibition. High pigment loading (20–35%) at 0.3–2.0 pph addition means the colourant barely moves the cured Tg, shrinkage or exotherm, and the 300 °C short-term rating covers wave-solder reflow and FBE oven cure without shade shift.
Insulation performance is engineered at the pigment-chemistry level. Low-Cl⁻ washed pigments (≤ 10 ppm, ≤ 5 ppm on IGBT grade), fineness tightened to ≤ 5 μm around chip and wire-bond structures, zero outgassing from the all-epoxy carrier, and thermally stable pigment chemistry together deliver volume resistivity ≥ 1 × 10¹⁴ Ω·cm and dielectric strength ≥ 18 kV/mm per GB/T 1408. Controlled carbon-black percolation delivers semi-conductive field-grading grades where they are needed around medium-voltage coils.
One compliance package covers electronics, anti-corrosion and composite markets. A properly specified SEP drum ships with REACH SVHC / Annex XVII declaration, RoHS 2011/65/EU compliance, IEC 60085 thermal-class qualification (B/F/H), GB/T 1408 dielectric-strength test data, UL 94 V-0 compatibility when formulated with FR additives, GHS/CLP SDS, CBAM carbon statement on request, IEC 61249-2-21 low-halogen grades, phthalate-free and heavy-metal-free documentation — covering transformer and IGBT encapsulation, copper clad laminate and PCB, FBE pipeline and tank anti-corrosion, epoxy flooring, and FRP composites.
About Dongguan DENSON Functional Materials Co., Ltd. — DENSON (brand: DENSON, export arm: Dongguan Henvastness Import and Export Co., Ltd.) formulates and manufactures epoxy-borne (SEP), polyol-borne (PUE), solvent-borne (FLTY), water-borne (GT), solvent-free (RFNC), UV-curable (FLUV) and electron-beam-cured color pastes for electronics encapsulation, protective coatings, inks and composite customers worldwide. For technical data sheets, samples and compliance declarations, visit www.densonchem.com or browse the product range.
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